Peoria, Arizona, USA – HyRel™ Technologies, a global provider of high-quality, quick-turn semiconductor modification solutions, announces that company Co-Founder and Managing Partner Brian Watson will present at the SMTA Ohio Valley Expo & Tech Forum, taking place August 20, 2026, in Independence, Ohio.
Watson will present “Meeting the Challenges of Proper Tinning Today,” addressing current considerations and challenges associated with proper component tinning in electronics manufacturing.
The Ohio Valley Expo & Tech Forum brings together electronics manufacturing professionals for technical presentations, industry exhibits, and opportunities to connect with suppliers and other members of the regional electronics community. HyRel’s participation continues the company’s involvement with SMTA technical and industry events.
HyRel specializes in semiconductor component modification and preparation services, including robotic hot solder component tinning, BGA component reballing, component taping and packaging, bake and dry packaging, and custom component solutions.
For complete event information and the technical presentation schedule, visit the SMTA Ohio Valley Expo & Tech Forum schedule.
HyRel is a worldwide provider of high quality, quick turn semiconductor modification solutions serving the military, space, automotive, energy and commercial markets to companies seeking to improve product reliability. For more information contact HyRel Technologies.
