HyRel Versacell System Wins 2025 Global Technology Award

PEORIA, AZ ― November 2025 ― HyRel Technologies, a global provider of quick turn semiconductor modification solutions, is proud to announce that its Robotic Solder Dip & BGA Reballing Versacell System has been named the winner of a 2025 Global Technology Award in the Soldering Robots category. The award was presented during a ceremony at Productronica in Munich, Germany on Tuesday, November 18, 2025.

HyRel’s proprietary “touchless” Micro-Robotic Nano Platform is at the heart of the Versacell System, enabling non-contact tin dendrite removal and precise solder alloy replacement. This breakthrough approach restores solderability with unmatched precision, speed, and repeatability—setting new standards for component reliability and process consistency in high-reliability markets such as defense, aerospace, and advanced electronics.

Designed to dramatically improve throughput, the Versacell System can process between 1 and 12 components, reducing cycle times from minutes on existing platforms to seconds per cycle—outpacing traditional manual and semi-automated methods while maintaining the highest quality standards. The system supports robotic hot solder tinning, BGA reballing, and lead finish conversion with superior control, helping manufacturers meet even the most stringent industry certifications with confidence.

“Our goal with the Versacell System was to deliver a truly next-generation solution for solder dip and BGA reballing—one that gives customers the repeatability, throughput, and process control they need to succeed,” said Brian Watson, Founder, HyRel Technologies.

In addition to its technical capabilities, the Versacell System is engineered for usability and sustainability. Its compact, modular platform integrates easily into existing workflows, features an intuitive operator interface, and reduces material waste through advanced eco-conscious processes.

This award reinforces HyRel Technologies’ position at the forefront of robotic soldering and highlights its focus on helping manufacturers achieve the highest levels of reliability.

Since 2005, the prestigious Global Technology Awards have recognized the absolute best new innovations in the printed circuit assembly and packaging industries. It brings together the global SMT and advanced packaging industry in a celebration of the companies and people that are achieving the highest standards and driving our industry forward. For more information, visit www.globalsmt.net.

For more information contact HyRel Technologies.